Ask the Experts
Automotive Hybrid, Electric and Autonomous – Addressing the Complexity of Modern Vehicles
Date: Tuesday, August 6
Time: 10:00am – 11:30am
Location: Exhibit Hall
Organizer:
Janet O’Neil, ETS-Lindgren
Planned Panelists:
Bob Mitchell, TUV Rheinland, Littleton, MA, USA
Garth D’Abreu, ETS-Lindgren, Cedar Park, TX, USA
Keith Frazier, Ford Motor Company, Dearborn, MI, USA
Jens Medler, Rohde & Schwarz, Munich, Germany
Cheyne Scoby, Rivian Automotive, Long Beach, CA, USA
Rich Boyer, Aptiv, Warren, OH, USA
Today’s complex vehicle platforms include propulsion, entertainment and safety related systems all having to function reliably without impacting safety or the legacy communications infrastructure. The increased interest in autonomous vehicles is also driving the need for more sophisticated automotive EMC design and test scenarios, such as those addressing EMC, sensors (including radar) and wireless considerations. This impacts both component level and full-vehicle level emissions and immunity.
Our Automotive “Ask the Experts” panelists represent a diversity of automotive related organizations, including full vehicle manufacturers, an integrated circuit (IC) test specialist, members of the ISO/CISPR D Automotive EMC Committees, an automotive test chamber and instrumentation manufacturer, and a commercial automotive EMC test lab. These experts will share their knowledge on current and future automotive EMC design and test considerations. Bring your questions or simply listen and learn.
Modern Solutions to the Increasing Demand for Smaller, Higher Performance PCB/IC/Chip Packages
Date: Tuesday, August 6
Time: 2:00pm – 3:30pm
Location: Exhibit Hall
Organizer
Anil Kumar, Principal Engineer, Intel
Planned Panelists:
Harry Skinner, Intel, OR, USA
Kendall Hiles, Siemens Digital Industries Software, NC, USA
Lijun Jiang, Missouri University of Science and Technology, MO, USA
Ken Willis, Cadence, CA, USA
This panel will focus on “Modern Solutions to the Increasing Demand for Smaller, Higher Performance PCB/IC/Chip Packages.” As the demand for smaller and higher performing electronic devices continues to grow, it presents unique challenges for Electromagnetic Compatibility (EMC), Signal Integrity (SI) and Power Integrity (PI) engineers.
The panel will explore the complexities and advancements in PCB/IC/Chip packages that enable smaller form factors while maintaining high performance. Our esteemed panelists, who are experts in the field, will share their insights and experiences in addressing these challenges.
Join us as we delve into topics such as miniaturization techniques, advanced packaging technologies, design considerations, and simulation and test methodologies. Discover the latest trends and innovative solutions that are revolutionizing the industry. Don’t miss this opportunity to engage with industry leaders, gain valuable knowledge, and network with professionals in the field. Whether you have burning questions or simply want to expand your understanding, this panel is a must-attend event for anyone involved in EMC and SI/PI for PCB/IC/Chip packages.
Step, Stir, or Shake: What’s Best for a Reverberation Chamber?
Date: Wednesday, August 7
Time: 10:00am – 11:30am
Location: Exhibit Hall
Organizer:
Vignesh Rajamani, Rohde and Schwarz North America
Planned Panelists:
Frank Leferink, Thales and University of Twente, The Netherlands
Mathias Magdowski, Otto-von-Guericke University, Magdeburg, Germany
Garth D’Abreu, ETS-Lindgren, Cedar Park, TX, USA
John Ladbury, National Institute of Standards and Technology, Boulder, CO, USA
Craig Fanning, Elite Electronic Engineering, Downers Grove, IL, USA
Reverberation chambers provide a versatile and efficient means of testing the electromagnetic characteristics of electronic devices in a controlled environment. Closely mimicking the real-world environment in which they operate, reverberation chambers are an essential tool in product development and certification processes. Testing in reverberation chambers is often done to ensure that electronic devices comply with regulatory standards for EMC and EMI. Although mode stirring, mode tuning, and “shaking of the walls” can be used to achieve a statistically uniform distribution in terms of amplitude, phase, and polarization, the natural debate is which is the best technique to use for a specific application.
Our “Ask the Experts” panelists represent a diversity of industry practitioners, academics, metrologists, and members of standard bodies. These experts will share their knowledge on current and future reverberation chamber test considerations. Bring your questions or simply listen and learn.
